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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 23 Jan 1998 15:42:18 -0600 |
Content-Type: | text/plain |
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All,
We are a small engineering and manufacturing company just getting into
surface mount assembly. We have been almost exclusively through hole but
with the elimination of many through hole parts, we find it necessary to
move on. Additionally, most of our manufacturing contracts in the past
were older 'build to print' jobs based upon old designs for our military
customers.
Soon, both manufacturing and engineering representatives will meet to
discuss manufacturing's design requirements. Because we have had so little
experience with surface mount assembly, we really don't know what to ask
for from a design for manufacturing standpoint.
I would be interested in any design specifications or really any reading
material that could point us in the right direction (i.e. pad geometry,
component orientation, etc.) as well as manufacturing
specifications/guidelines (i.e. stencil printing, solder reflow, etc.). We
are currently reviewing IPC-S-816, D-279, and SM-782.
Thank you all in advance of your support.
Steve McBride
Manufacturing Engineer
Frontier Electronic Systems Corp.
(www.FEI-CORP.com)
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