We are looking for data, papers or personal experience with regards to
dead pad removal (both signal and plane layers) and the impact on hole
wall reliability.
Board type: 4 - 14 layers, 20 - 100 mils thick, FR-4 material and other
material types if available.
I appreciate any information you may have.
Regards,
Dave Backen
[log in to unmask]
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################