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January 1998

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TechNet <[log in to unmask]>
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Date:
Thu, 8 Jan 1998 09:43:29 EST
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"TechNet Mail Forum." <[log in to unmask]>, SIRGuru <[log in to unmask]>
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Subject:
Re: Gold Plating Question
From:
SIRGuru <[log in to unmask]>
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AOL (http://www.aol.com)
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text/plain (27 lines) 
In a message dated 98-01-07 08:47:45 EST, you write:

>
>  I am looking for guidance on choosing gold plating thicknesses and
>  plating processes for circuit board edge fingers.  For example: What are
>  the recommendations for circuit board edge fingers that will be inserted
>  into a connector and removed 10 times verses a installation/removal
>  cycle of 50 times?

Along the same lines, I have an application where I mate / de-mate a connector
hundreds of times.  I would ask the TechNet crowd which would be better, gold
or a hard nickel?

Doug Pauls

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