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Thu, 29 Jan 1998 15:19:48 -0600 |
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IPC-MF-150F Metal foil for Printed Wiring Applications
Rev Oct 191
Amendment 1 Aug 92
"This specificaiton covers monolithic metal foils, either supported by carrier films
or foils, or nsupported, suitable for subsequent use in printed boards."
Related documents:
IPC-L-108B Specification for Thin Metal Clad Bse materials for Multilayer Printed
Boards
IPC-L-109B Specificaiton for Resin Impregnated Fabric (Prepreg) for Multilayer
Printed Baords
IPC-L-112A Stand for Foil Clad, Composite Laminate
Jack Crawford, IPC Project Manger - Assembly
2215 Sanders Road, Northbrook IL 60062-6135
[log in to unmask] http://www.ipc.org
847-509-9700 x 393
fax 847-509-9798
>>> Sheila Smith <[log in to unmask]> 01/29/98 01:59PM >>>
Hello,
Can anyone tell me what IPC-MF-150/1*TEGIVS is ?
Thanks ............
Sheila Smith
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Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
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