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Mon, 26 Jan 1998 17:16:11 -0500 |
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ACI/EMPF |
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Tim,
There are a number of ways to place thermocouples in the center most
leads/balls of a BGA. This is of course dependant on the component and
board configurations. If you have access to one side of the board and the
BGA pitch isn't too fine, getting a thermocouple into a ball on the under
side of the BGA isn't too hard. If you want to know more, contact me
off-line.
John Guy
ACI / EMPF
714 N. Senate Ave.
Indianapolis, IN 46202-3112
voice: (317) 655-EMPF ext.130
fax: (317) 655-3699
e-mail: [log in to unmask]
-----Original Message-----
From: Stammely, Tim [SMTP:[log in to unmask]]
Sent: Monday, January 26, 1998 4:56 PM
To: [log in to unmask]
Subject: [TN] BGA reflow oven profile?
Where should I place my thermocouples to determine the best oven profile
for assemblies having BGAs since their leads aren't reachable, and how
should I attach them?
Thanks
Tim Stammely
Manufacturing Services & Integration (MSI)
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