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January 1998

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TechNet <[log in to unmask]>
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Date:
Fri, 23 Jan 1998 07:54:06 -0800
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Subject:
Re: air voids in multi
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From:
Tony King <[log in to unmask]>
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text/plain (21 lines) 
Low pressure areas can be difficult sometimes,  have you tried the specialized
press pads designed to even the pressure distribution across the panels ?  There
are many on the market and they do work very well (from experience).  I have
been successful using these to press up to 5oz. copper internally with minimal
resin voids.

Tony King
Sanmina Nashua N.H.
603-886-0066

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