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Fri, 16 Jan 1998 13:30:40 -0500 |
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We are located in Grand Rapids Michigan. We are moving across town to
a new building which is being renovated to suit our needs. With a
tight budget getting tighter, there is a somewhat political and
emotional contest in the making.
By title our assembly facility will be called the "Engineering
Manufacturing Development Center (EMDC)". Engineering activity is
located in Grand Rapids, Mi. while production manufacturing will be
located in Clearwater, Fla. The EMDC will have process development,
low volume and transition responsibilities.
We assemble primarily SMT boards but there is some thru-hole and mixed
technology as well. Processing in the EMDC includes wave, vapor
phase, and hand soldering. IR, convection ovens or even new technolgy
soldering may be added later, as well. Our boards are primarily rigid
polyimide boards but flex and rigid-flex boards are processed
occasionally. Thermount boards are being considered for the future.
Cu-Invar-Cu and Cu-Mo-Cu stabilizing cores are frequently employed for
CTE stabilization.
We will be using more and more plastic and commercial parts and less
of the ceramic and military grade parts, as is the industry trend. It
also goes without saying that expect to track industry trends in
technology, components and processing.
We are in the business for the long term. We started our operations
in GR in the early 1950's and we will have a 20 year lease on our new
facility. Our business niche is high technology commercial and
military avionics. Our facility size is almost 900,000 Sq.Ft. and the
EMDC and circuit card assembly areas could be as large as 15K-25K Sq.
Ft. in size.
With that as background, the question is as follows;
What temperature / humidity requirements would you recommend for
the EMDC and assembly areas of our new facility?
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