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Fri, 9 Jan 1998 14:33:51 EST |
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In a message dated 98-01-09 11:15:12 EST, you write:
> Alan,
>
> Someone may have already replied with this information and I just missed
it, but
> from an assembly point of view, the biggest benefit of the immersion gold
over the HASL
> is the flatness achieved on the pads on fine pitch surface mount parts.
This is critical
> for 20 mil and below fine pitch assembly yields.
Another significant advantage of gold over HASL is cleanliness. HASL is a
dirty process that often leaves high levels of halide on a board. Halides are
death to high impedance devices. Gold is generally a very clean process,
assuming you have good rinsing after the acid plating processes.
Doug Pauls
CSL
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