Although there is no probable manufacturing issue, the potential for
bare copper oxidization exists for your application since the last
process for flex fabrication is panel separation by the use of a steel
rule die and/ or a hard tooled die. Knowing somewhat about your typical
product life, such a potential is negligible, but I would let the lead
mechanical engineer on the program determine the risk.

For a summary of resources on flex design, see my article on the January
'98 issue of Miller Freeman's Printed Circuit Design Magazine.
Chris Taylor
Senior Printed Circuit Designer
LXE, Inc.
125 Technology Parkway
Norcross, GA 30092
voice: (770) 447-4224 X3242
fax: (770) 447-6928
e-mail: [log in to unmask]


>
>Hi,
>
>I am working on a Flex Circuit. Is there a minimum board edge to metal
>clearance of flex. The engineer wants a part placed on the board leaving
>the pad exposed on the edge of the flex circuit. I said you cant do this,
>he says it OK. Is this legal?
>
>Wayne
>

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