Scott Buscomb wrote:
>
> What is the reasoning behind setting copper back from the board
>edge by
> .030-.040 besides tolerancing and the possibility of cutting the
>trace?
> I would like to bring a copper feature right to the edge of the board
> (trimmed during the routing process) for a shield base. Is there any
> hidden problem with cutting copper w/plating during the routing
>process?
>
> Any comments?
> Thanks,
>
> Scott
> --
> Scott Buscomb, Senior Designer
> [log in to unmask]
> Techsonic Industries
> 1111 Alderman Dr. Ste. 250
> Alpharetta, GA 30005
> 770 475-3020 ext.1032


...Along the same lines,

One thing I like to do on our high layer count boards is intentionally put
a non-connected copper rectangle, say .050 x .050, on each layer
in a cascading or stairstepped manner over the profile edge. When the profile
is routed these features, at a glance, can prove that all layers were indeed
stacked correctly. Further, if you put these features on three sides you can
determine, roughly, how well the panel was registered.

Shawn Utz
Tera Computer Company

##############################################################
IPC Designers Council Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE DESIGNERCOUNCIL <your full name>
To unsubscribe:   SIGNOFF DESIGNERCOUNCIL
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################