At 10:23 PM 1997/12/7 EST, you wrote:
>Assuming your developing process is in spec, soldermask residue is indicative
>of too high a temperature at tack cure; overexposure could also cause the
>problem.
>
>Where is the residue?  Is it on the fiberglass or the copper or both?
>Give me your process parameters and I'll try to help.
>
>Mark Dowding
>Regional Technical Service Manager
>INSULECTRO
>

Thank you for your quick  suggestion, for the parameters you need, I have
to ask for our Engineers,
once when I get it, I'll send to you.

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