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December 1997

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Subject:
Re: Under Develope of the Wet Film Solder Mask
From:
Dryfilm <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Sun, 7 Dec 1997 22:23:42 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
Assuming your developing process is in spec, soldermask residue is indicative
of too high a temperature at tack cure; overexposure could also cause the
problem.

Where is the residue?  Is it on the fiberglass or the copper or both?
Give me your process parameters and I'll try to help.

Mark Dowding
Regional Technical Service Manager
INSULECTRO

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