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From: | |
Reply To: | TechNet Mail Forum. |
Date: | Fri, 5 Dec 1997 21:44:07 EST |
Content-Type: | text/plain |
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Sorry , I do not like to create any controversy about electroles copper and
electroplated copper from physical properties point of view..but fact of life
of manufacturing on floor that.....( and no body can deny..)
1. All data provided , created by vendor , prepared under strict cintrol
condition which
hardly gets repeatd in shop.
2. Electroless copper is always spongy, etch off two to three faster than
electrolyic
copper in microetch
3. Electroless copper grain structure varies from bath to bath, chemistry,
and other
combination of physical parameters controling the process from hour to
hour.
4 Properties of electrolytic copper also varies similarly.
5. In microetch, electroless copper creates lot of mud like stuff means smut
due to
lot of organic material between/ in grain boundries.
6. Electroplated copper is dandrite as a foil copper and amorphous as plated
on
PCB and electoless with big grains which can judged from micro-section
easily.
7. Definitly, there are changes in morphology of copper in PCB plating from
time to
time whihin acceptable limits of quality.
Fulabhai [log in to unmask]
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