TECHNET Archives

December 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Gary D. Peterson" <[log in to unmask]>
Reply To:
Date:
Mon, 1 Dec 1997 09:26:10 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (47 lines)
I've been watching the comments regarding TSOP reliability issues for
over a year.  I suspect there is some quantitative data available by
now but I need help finding it.

Question #1.  How do I reliably determine whether the parts I've
              soldered to my boards have Alloy-42 leadframes?
              Is the magnet test fool-proof?

Question #2.  Some of our boards undergo EXTREME temperature cycling.
              Is there any quantitative data available that would
              help us predict failure rates of Alloy-42 v/s copper
              leadframe TSOPs?  Is there any data that shows what
              improvement can be gained by underfilling?

Question #3.  Any comparisons between Type 1 and Type 2 TSOPs?  I
              would generally expect Type 1 to be the worst.

Question #4.  Any data showing how die size affects the overall
              package CTE?

I'd be happy to execute non-disclosure agreements,if necessary,
in order to acquire actual data.

--

                                  Gary D. Peterson
    _/_/_/   _/    _/  _/        SANDIA NATIONAL LABORATORIES     _/_/_/
   _/       _/_/  _/  _/        P.O. Box 5800, M/S 0503            _/_/
  _/_/_/   _/ _/ _/  _/        Albuquerque, NM 87185-0503
_/_/_/_/_/_/
     _/   _/  _/_/  _/        Phone: (505)844-6980           _/  _/_/
_/
_/_/_/   _/    _/  _/_/_/_/  FAX: (505)844-2925             _/  _/_/  _/
                            E-Mail: [log in to unmask]        _/_/_/

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################


ATOM RSS1 RSS2