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December 1997

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Subject:
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 1 Dec 1997 11:21:00 -0400
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (33 lines)
We do use via-in-pad technology for our BGA components.  Our boards are
designed, however, with a thin layer of polyimide which is bonded to the back
side of the multilayer board.  During the bonding process, the vias get filled
with resin.  We then require our suppliers to copper plate over the resin
filled vias then solder coat.  The result is a solid surface mount pad with a
via inside which is undetectable.

Jim Marsico
(516) 595-5879
[log in to unmask]

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