Marcello:

     Yes, each thermal cycle will remove a small portion of the ENTEK-106A.
     However, ENTEK-106A will withstand 6-8 thermal cycles before it is
     sufficiently degraded to be of concern (and that is typically at 200+
     degrees C.).  In addition, the first thermal cycle actually makes it
     more chemically resistant.

     Since the typical process flow is either single reflow (1 cycle), dual
     reflow (2 cycles), single reflow with wave solder (2 cycles) or single
     reflow with Glue + wave solder (3 cycles), there is more than enough
     margin for a bake after ENTEK application.  Right?

     Bill Fabry


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Subject: Re: [TN] entek plus process
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