Marcello:
Yes, each thermal cycle will remove a small portion of the ENTEK-106A.
However, ENTEK-106A will withstand 6-8 thermal cycles before it is
sufficiently degraded to be of concern (and that is typically at 200+
degrees C.). In addition, the first thermal cycle actually makes it
more chemically resistant.
Since the typical process flow is either single reflow (1 cycle), dual
reflow (2 cycles), single reflow with wave solder (2 cycles) or single
reflow with Glue + wave solder (3 cycles), there is more than enough
margin for a bake after ENTEK application. Right?
Bill Fabry
______________________________ Reply Separator _________________________________
Subject: Re: [TN] entek plus process
Author: "TechNet Mail Forum." <[log in to unmask]> at INTERNET