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December 1997

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Fri, 5 Dec 1997 14:26:34 EST
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The October Project Section of ITRI is surveying the industry for techniques
of filling both conductive and non-conductive materials into vias.  The final
objective is design of a challenging multilayer microvia test structure.
However,  a subcommttee is surveying the fill of both conventional through
board vias and filling microvias for planarization.  Planariztion is critical
to make multilayer microvias, particularly with the vias vertically stacked
for maximum density.

Committee work underway includes literature and patent searches, process
descriptions, and this TechNet survey to see the state of technology.  John
Davignon of Merix is the overall Task Group Chairman, and Rich Wessel of
DuPont is section chairman on via filling.  I just boasted that TechNet would
be a good source of information to meet our survey deadline of January 9, so I
get to send this.

How are you filling vias today in your shop?

Denny Fritz
MacDermid - Waterbury

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