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December 1997

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Subject:
From:
Matthew Park <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 5 Dec 1997 09:58:28 -0800
Content-Type:
text/plain
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text/plain (36 lines)
I am getting confusing responses from a board vendor that
uses in-line process, and from a board vendor that uses
dipping process to coat boards with Entek Plus.

What are advantage/disavantage using either process?

What are problem associated with boards that were
fabricated using dipping process?

Does in-line processing provide better consistent and
controllable coating (typ: 0.35um) than dipping process?

Is there any other coating thickness measurement technique
used by board vendors other than the sampling method
specified by Enthone using UV spectrophotometer?

What are some of inspection method employed by board
vendors to check boards are coompletely dry prior packaging
and shipping?

advance thanks
regards
Matthew

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