HI TOMER,

YOU ARE BETTER ADVISED TO SOLDER LEVEL THE TABS THEN STRIP PRIOR TO GOLD
PLATING. THE MAIN REASON BEING A TAPE TO WITHSTAND THE THERMAL STRESSES
ASSOCIATED WITH THE LEVELLER, IS DIFFICULT TO FIND AND MAY NOT EVEN BE
AVAILABLE. IF YOU WANT TP PROCEED IN THAT ROUTE, THEN I SUGGEST USING A DRY
FILM OR LIQUID MASK THAT COULD WITHSTAND THE STRESSES AND ALSO REMAIN
RELATIVELY EASY TO STRIP.

 IF THE CONNECTORS ARE EDGE-PANEL TYPES THEN STRIPPING AND PLATING BECOMES
EASY,
HOWEVER, IF YOU HAVE TO PATTERN  PLATE THEN YOU MAY NEED TO MASK THE SOLDER
AREAS THEN STRIP AND PLATE AND REMOVE MASK. A TAPE IS WIDELY USED FOR THIS
STEP, TAPE MAT'L BEING ABLE TO WITHSTAND THE STRIPPING AND PLATING
CHEMISTRY.

GOOD LUCK
LENNY KURUP
EMX ENTERPRISES LTD
905-475-8000



 On
Sun, 30 Nov 1997, Tomer_2 wrote:

>   Technetters,
>
> 1) We are interested in tape as protection for  gold connectors  before
> HAL.
>
> Would someone please contact me with recommendation and past experience
> on such kind of tape. (Is it applied and removed manually?, Should the
> boards brushed after removing the tape?.
>
> 2) We are looking for special rubber (If there is such) to clean "dark
> gold fingers"
>
> Any feedback would be much appreciated
>
> Tomer
>
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