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December 1997

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Subject:
ASSY: Eutectic TBGA Reliability
From:
Charles Elliott <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 4 Dec 1997 17:02:35 -0500
Content-Type:
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text/plain (26 lines) 
Subject: ASSY: Eutectic TBGA Reliability                  1997.12.044:56 PM

Hi 'Netters,

I am looking for technical articles on TBGA reliability (board level). It has
a wirebonded die and eutectic solder balls.  (Manufacturer refers to it as an
HBGA-1).

Thanks in advance.
Charles Elliott
NPI Process Engineering
Newbridge Networks
[log in to unmask]

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