Guenter:

Back on November 18th, you sent a message to the TechNet concerning
reliability of J-Leads when subjected to thermal cycling. Within the text of
that message you made a comment which stated:

" - A good deal of the damage that occurs during thermal cycling in the
solder joints of leaded components is not due to the global mismatch of
component and PCB but due to the local mismatches of pin / PCB; pin /
solder."

Sounds like you had a problem at one time with a solder joint with a leaded
component.

I would like to ask if you could elaborate further about this, but not
necessarily through TechNet.

Either call me or e-mail if you could spare a few moments to discuss.

Thanks,

Bill Kasprzak
Moog Inc.
716-652-2000 ext. 2507
email:  [log in to unmask]

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