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Date: | Wed, 31 Dec 1997 23:24:28 -0500 |
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Werner and all,
Does anyone know if the ultrasonic methods for delamination detection in
components are powerful/sensitive enough to look through BGAs to find
either gross opens and/or hairline cracks in the BGA solder joints ?
Bev Christian
Nortel
>----------
>From: Engelmaier[SMTP:[log in to unmask]]
>Sent: Wednesday, December 31, 1997 5:39 PM
>To: [log in to unmask]
>Subject: Re: [TN] Crack detection under BGA?
>
>Hi Kevin,
>The only way you have a chance of finding cracked solder joints in product
>with BGAs is to functionally test while subjecting your assemblies to
>vibration. This gives you a chance of finding fully fractured solder joints,
>as well as use the vibration as a screening test for latent defects. However,
>with BGAs, I am not certain that even this method is 100% effective.
>
>Werner Engelmaier
>Engelmaier Associates, L.C.
>Electronic Packaging, Interconnection and Reliability Consulting
>7 Jasmine Run
>Ormond Beach, FL 32174 USA
>Phone: 904-437-8747, Fax: 904-437-8737
>E-mail: [log in to unmask]
>
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