Hi Kevin,
The only way you have a chance of finding cracked solder joints in product
with BGAs is to functionally test while subjecting your assemblies to
vibration. This gives you a chance of finding fully fractured solder joints,
as well as use the vibration as a screening test for latent defects. However,
with BGAs, I am not certain that even this method is 100% effective.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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