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December 1997

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Subject:
Re: Plating
From:
Al Hamilton <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 3 Dec 1997 16:01:13 -0500
Content-Type:
text/plain
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text/plain (18 lines) 
The basic reason is uniformity. Since panel plating is inherently more
uniform than ordinary pattern plating, the more copper you plate via panel,
the more uniform the end result. The obvious disadvantage is in etching as
well as limitations on achievable line widths. Pulse plating can solve this
dilemma by producing a more uniform distribution while pattern plating.

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