Mickey,

I don't have a J-Std-013 handy now. I believe it states that the 4-mil
spec. applies only to the leaded components, i.e. QFP while the spec. for
BGAs is 8 mils. Could you verify this?

Thanks,

Yuan Li
Research Associate
CAMPmode (Center For Advanced Manufacturing and Packaging of Microwave,
Optical and Digital Electronics)
University of Colorado at Boulder

On Tue, 30 Dec 1997, mickey weiner wrote:

> Dennis Fall wrote:
> >
> > I was wondering if there is an industry standard for coplanarity of
> > solder spheres on a BGA package.  Any insight will be greatly
> > appreciated.
> >
> > --
> > Dennis ,
>    I find in j-std 013 (4.3.2) that accepted coplanarity throughout
>    the component lead configuration is 0.1 mm (4 mils).
>    It does not specify if it takes into account both ball variation
>    as well as substrate's bow & twist.
>
>    Season's Greetings to everybody on TechNet
>
>     Mickey
> --
>    ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
>          michael weiner    Tadiran Telecommunications Ltd
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