Subject: | |
From: | |
Reply To: | TechNet Mail Forum. |
Date: | Tue, 30 Dec 1997 07:37:52 -0700 |
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Try www.flipchip.com
[log in to unmask]
> ----------
> From: Bob Willis[SMTP:[log in to unmask]]
> Sent: December 29, 1997 8:47 AM
> To: [log in to unmask]
> Subject: [TN] Bumped Flip Chip
>
> I would appreciate obtaining some sources for bumped flip chip
> devices. The
> requirement is for 3000 non specific devices with tin lead
> terminations. If
> any one has some contacts please let me have full details Tel, fax,
> email.
>
> Many thanks.
>
> "THE SOLUTION PROVIDER FOR YOUR MANUFACTURING PROBLEMS"
>
> Bob Willis
> Process Engineering Consultant
> Electronic Presentation Services
> 2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
> Tel: (44) 01245 351502
> Fax: (44) 01245 496123
> Mobile: (44) 0860 775858
> Email: [log in to unmask]
> Internet Home Page: http://www.bobwillis.co.uk
>
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