Dennis Fall wrote:
>
> I was wondering if there is an industry standard for coplanarity of
> solder spheres on a BGA package. Any insight will be greatly
> appreciated.
>
> --
> Dennis ,
I find in j-std 013 (4.3.2) that accepted coplanarity throughout
the component lead configuration is 0.1 mm (4 mils).
It does not specify if it takes into account both ball variation
as well as substrate's bow & twist.
Season's Greetings to everybody on TechNet
Mickey
--
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