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December 1997

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Subject:
From:
Dennis Fall <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 29 Dec 1997 12:03:45 -0600
Content-Type:
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I was wondering if there is an industry standard for coplanarity of
solder spheres on a BGA package.  Any insight will be greatly
appreciated.

--
Dennis Fall
Development Engineer Assistant
Thin Film Technology Corporation
1980 Commerce Drive
North Mankato, MN  56003-1702

P:  507-625-8445 x17
F:  507-625-3523
email: [log in to unmask]
http://www.thin-film.com

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