Since there probably aren't too many of us left on the `Net at this hour of
the California day, I'll take a crack at it: An isotherm is another term
for thermal relief.

HAPPY HOLIDAYS TO ALL THOSE WHO HAVE KEPT US INFORMED OVER THE `97 YEAR!!
LOOKING FORWARD TO MORE OF THE SAME IN `98!!






[log in to unmask] on 12/23/97 04:37:27 PM

Please respond to [log in to unmask]; Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Tom Bresnan/Multek/DIIG)
Subject:  Re: [TN] heeelp -  NON-THERMAL RELIEVED VIAS AND COPPER PLANES




Can any one explain what is isotherm pattern and what are the advantages of
having it on fab?
Merry Christmas to all you and your family.
re,
ken patel
At 09:25 PM 12/21/97 -0500, D. Rooke wrote:
>In addition to Werner's comments, I would suggest that if your fracturing
>occurs exclusively on the oxide side of your via to barrel interface, your
>oxide process may not be optimum for this type of product design.
>
>Challenge your designer and inquire why no isotherm pattern is used.
>
>Dave Rooke
>Viasystems Canada
>
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______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
575 Cottonwood Dr.              Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808
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