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Subject:	Re: heeelp - NON-THERMAL RELIEVED VIAS AND COPPER PLANES
From:	Ken Patel <[log in to unmask]>
Reply To:	TechNet Mail Forum.
Date:	Tue, 23 Dec 1997 16:37:27 -0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (50 lines)

Can any one explain what is isotherm pattern and what are the advantages of
having it on fab?

Merry Christmas to all you and your family.

re,
ken patel

At 09:25 PM 12/21/97 -0500, D. Rooke wrote:
>In addition to Werner's comments, I would suggest that if your fracturing
>occurs exclusively on the oxide side of your via to barrel interface, your
>oxide process may not be optimum for this type of product design.
>
>Challenge your designer and inquire why no isotherm pattern is used.
>
>Dave Rooke
>Viasystems Canada
>
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______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
575 Cottonwood Dr.              Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

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