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December 1997

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Wed, 3 Dec 1997 13:07:48 -0500
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Plating: low electroless with flash plate Vs. Heavy electroless
  Now a days , both methods are successful . It depends  upon degree of
confiedence developed in final tune up of process, success rate , operator
understading, other  availibility of cleaning equipments, attitude not to
change anything if it works good etc. It varies from shop to shop as part of
integrity of
process.
    Heavy electroless  requires very tight lab. control. It has own
problems,sometimes
more problems for high plating rate. Medium plating bath are reasonably
controllable.
Low plating baths are very friendly, which requires flash plate...
   Another important thing is how you control microetch after acid cleaner in
order not to have VOIDS.Every shop has own way of life...There is no rational
one point answer. Personally, I prefer medium plating rate bath,to deposit 50
 microinches of
copper , no flash plate, tightly controlled  microetch...and it works
beautiful...

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