I have had good experience with both Universal and Camalot systems for
adhesive dispensing.  I am presently using Hereaus PD944.  This is
formulated for high speed dispensing.  Don't forget, adhesive dispensing
should be faster than the chip placer.

If there is a 0.030" gap between pads, don't make your dot 0.030"!!!!!!
When you place the component, the dot will spread out under the component.
It is very important that you keep the adhesive off of solderable areas.

There have been numerous articles in magazines about dot diameters, and all
the companies above can assist if needed.





[log in to unmask] on 12/02/97 09:08:33 AM

Please respond to [log in to unmask]; Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Ed Holton/Hella North America Inc.)
Subject:  [TN] ASSY:  SMT Gluing




Does anyone have any recommendations (or good experience) with a
particular SMT component glue and/or equipment?

In particular, I am using Contact Systems' Gluer which is an
accessory on a CS3AV, with Loctite 3609, and a .030 tip.  I would
like to achieve a .030 DIA dot, as this is the distance between pads
(on 0805's).

Thanks in Advance,

Lainie Loveless
General Atronics Corp
Wyndmoor, PA
(215) 242-7336

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