Subject:Plating Adhesions and Poisoning
                                   Date:12/22/97            Time:11:46 AM
              Internal Memorandum

We're currently working on several problems that someone may have previously
encountered.  What tests or standards exist for measuring the adhesion of
gold or silver plating  to electrical feed through pins?  Is this typically
performed on a routine basis?  Is a quantitative measure of the adhesion
obtainable?  Second issue is the poisoning of a wave solder bath when brass
pins are used in the pwb.  Does the Z n, Cu etc. significantly affect the
solder bath performance?  What are the typical consequences for a "brass"
poisoned  bath?  Thanks for your consideration and responses to our issues.
If you'd prefer, please send a response directly to my email at
[log in to unmask]         Happy Holidays!!

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