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December 1997

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Subject:
From:
Charles Barker <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 19 Dec 1997 09:06:10 -0600
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Charles Barker@I-O INC
12/19/97 09:06 AM

Hi Sheila,

We have encountered separation of the inner layers from the barrel of the
holes. This may have been due to too much heat at hand solderiing or it may
have been defective plating in the hole in the first place.  In the
particular instance that comes to mind, there were no outwardly visible
signs of overheating. After sending some of the failed boards out for
cross-section analysis, we found that there was a plating problem in the
board fab. How that passed the float solder test etc. (these were supposed
to have been tested to class 3) I don't know. The lab found failures in the
vias as well as in the hand soldered holes. Outwardly, everything looked
fine.

The best to you and yours,

Charlie B.





[log in to unmask] on 12/19/97 08:10:04 AM

Please respond to [log in to unmask]; Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Charles Barker/US/I-O INC)
Subject:  Re: [TN] hand soldering on wave soldered board




TechNetters,
What kind of damage could I expect to see if  too much heat was applied
when
a component  was hand soldered onto a multilayer board which had been wave
soldered ?
IE measling, discoloration, blistering, or possibly no visible damage?
Thanks in advance for any assistance.
S. Smith, Tracor
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