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December 1997

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 22 Dec 1997 15:03:23 +1100
Content-Type:
text/plain
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Hi Graham ;
you right, it is interesting, it does look like an ad, we'll think about
it .
Thanks so far .                              Paul

>----------
>From:  Graham Naisbitt[SMTP:[log in to unmask]]
>Sent:  Sunday, December 21, 1997 11:11 AM
>To:    [log in to unmask]
>Subject:       Re: [TN] IPC-SM-785 Accelerated reliability Test Vehicle samplesize
>
><<File: ATT00118.html>>
>Jeff
>
>I apologise for this tardy response, but my laptop died a few days ago and I
>have been somewhat pre-occupied with attempts at resuscitation.
>
>However, we have a suggestion to make in respect to your apparent problem.
>
>As I understand it, you have an issue of circuit assembly reliability which
>you consider is caused by some synergistic influences within your
>manufacturing processes? If so, you should note that there are new standards
>under preparation to assist and that whilst these are awaited, you may wish
>to consider the following:
>
>We have a new test system, Auto-SIR, with FMTA to accurately predict (PQV)
>and monitor (PQM) the quality and reliability of your product.
>
>FMTA - Frequent Monitoring / Trend Analysis
>PQV  - Process Quality Validation
>PQM  - Process Quality Monitoring
>
>I am sure you will be familiar with the following:
>
>J-STD-001B  - Manufacturing
>J-STD-004 - Solder fluxes
>IPC-CC-830 - Conformal Coating
>IPC-SM-840 - Solder Masks / Resists
>IPC-TM-650 - Test Methods Manual
>IPC-9201 - SIR Test Handbook
>
>These of course form the foundations of standards for Materials
>Characterisation and, it is hoped, Process Characterisation.
>
>We can measure the actual effects of both Ionic and Non-Ionic contamination
>on the surface insulation resistance of your representative assembly under
>conditions of accelerated ageing, to better predict the reliability of your
>product.
>
>As a result of no-clean processing and the increasing use of non-ionic
>additives in modern process chemistries, such as solder resists,
>fluxes/pastes etc., the ability to monitor their synergistic effects is now
>an essential element in quality control.
>
>We can provide
>a.. Very low test leakage current detection ( <10-12 A) providing far more
>sensitive analysis.
>    b.. Sample monitoring at 10 minute intervals. Thus giving far greater
>opportunity to detect  Electro-Migration in the form of Dendrites. (We know
>that dendrites can form within 20 minutes.)
>
>    c.. Dendrite preservation to facilitate subsequent and separate failure
>analysis.
>    d.. Detection of CAF influences.
>    I appreciate that Ion Chromatography (IC) will be able to determine
>precisely what is on the circuit, but not whether the circuit will be
>reliable. SIR testing using these new techniques, is able to inform you of
>whether the circuit is reliable but not what is on the suface causing it. You
>need both, SIR then IC if you find a problem.
>
>I hope that you will find this of interest and that you will contact me
>directly if you would like more info.
>
>Please accept my apologies if this seems too close to an advert, I cleaned it
>up as best I could in the spirit of the TechNet.
>
>HAVE A VERY MERRY XMAS AND A HAPPY, HEALTHY AND PROSPEROUS NEW YEAR
>
>Graham Naisbitt
>__________________________________________________________________________
>[log in to unmask]
>
>Concoat Ltd
>Alasan House, Albany Park
>Camberley GU15 2PL UK                        http://www.concoat.co.uk
>
>Application Engineers in Chemical Compounds to the Electronics Industry
>
>-----Original Message-----
>From: Jeff Mallia <[log in to unmask]>
>To: [log in to unmask] <[log in to unmask]>
>Date: 18 December 1997 05:22
>Subject: [TN] IPC-SM-785 Accelerated reliability Test Vehicle sample size
>
>
>>Hello Technet,
>>
>>I am working with a small team introducing an SMT production line.
>>
>>Currently I am designing a test vehicle for the accelerated reliability
>>thermocycling for our first process validation.
>>
>>
>>I have read the SM-785 "Guidelines for Accelerated testing..." and would
>>like to know if anyone can clarify in the Appendix A, step by step
>>example, why 32 groups of 8 series capacitors were used instead of just
>>32 individually monitored capacitors?
>>
>>Thanks
>>
>>Jeff
>>
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>

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