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December 1997

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Subject:
Re: FAB: Laser Blind Vias
From:
Motoyo Wajima <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Sun, 21 Dec 1997 13:25:04 +0900
Content-Type:
text/plain
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text/plain (91 lines) 
Motoyo Wajima <[log in to unmask]>  $B$5$s$N%a%C%;!<%8$rE>Aw$7$^$9!' (J
Mr.Sauter!
World wide production quantities of Build-Up Multilayerboards in 1997 are the
following.

 Area        Total Quantities(m2/month)       Laser via quantities(m2/month)

Japan            43,000                           29,000
                                              CMK,JVC Victor,Airex,
                                              Yamanashi Matsusita Electric Work,
                                              Meiko,Eastern,etc.

Europe             700                            500 $B!A (J600
                                              Siemens

Asia                0                                0

U.S.A.           3,000                          1,000 $B!A (J1,500?
                                              Hadco $B!$ (JAutomata $B!$ (JWL Gore,ACI,
                                              SHELDAHL

Regards,

Motoyo Wajima
General Purpose Computer Division,Hitachi,Ltd.,Japan


Karl Sauter <[log in to unmask]>  $B$5$s$O=q$-$^$7$?!' (J
>Technetters,
>
>Which PWB fab manufacturers are currently (today) using lasers
>to ablate (drill) blind vias on volume production product(s) ?
>
>Japan ?
>
>U.S.A. besides Automata ?
>
>etc.
>
>
>Regards,
>
>Karl Sauter
>Sun Microsystems
>(408) 276-5499
>
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***********************************************
Motoyo Wajima
General Purpose Computer Division,Hitachi,Ltd.
1 Horiyamashita
Hadano-shi,Kanagawa-ken,259-13 Japan
E-mail:[log in to unmask]
Fax:+81-463-88-2935
***********************************************

***********************************************
Motoyo Wajima
General Purpose Computer Division,Hitachi,Ltd.
1 Horiyamashita
Hadano-shi,Kanagawa-ken,259-13 Japan
E-mail:[log in to unmask]
Fax:+81-463-88-2935
***********************************************

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