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December 1997

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Subject:
From:
Ulrich Korndoerfer <[log in to unmask]>
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Date:
Tue, 2 Dec 1997 23:31:45 +0100
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Jim,

we have good experience with Dow Corning Q1-9226. It is a well
established, pasty, 2 component, alumina filled, heat curing (at least
100°C, up to 200°C for snap curing) silicon adhesive with a pot life
(after mixing 1:1 by weight) of about 8 hours. As it is from the
addition curing type, it does not generate byproducts during curing. As
the coherent force (the inner rigidity of the glue) is lower than the
adherent adhesion force, one can increase lap shear forces far above the
values given in the data sheets by making the glue film as thin as
possible (lower than 50 micrometers). This also will give you low
thermal resistivity.

Hope that helped a little

U. Korndörfer (not working for or associated with Dow Corning)

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