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December 1997

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Subject:
From:
"D. Rooke" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 17 Dec 1997 20:41:36 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (40 lines)
This request is probably difficult to pinpoint in only a few words, however,
I would say that the best guideline is that the uniformity of copper density
should be symmetrical at any point from the centre of mass of the board.
This includes not only the X-Y density of each individual layer, but also
spacing and thickness of each layer in the Z axis.

Dave Rooke
Viasystems Canada
= = = = =
At 10:40 AM 17/12/97 -0800, Engineering / Design Dept. wrote:
   <snip>

>ARE THERE ANY SPECS OR GUIDELINES TO FOLLOW IN REGARDS TO THE BEST
>SPACING, ETC TO ACHIEVE FLAT BOARDS?
>
>THANKS
>--
>******************************
>     Mission Peak Services
>
>   Engineering Department
>
>        Visit us at:
>
>  http://www.missionpeak.com
>******************************
>-EOF-

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