Is there any recommendation from the reliability point of view whether to
plug the all non-vias or keep the vias open and let it be filled up during
wave solder operation?

Any comment/concern in removing the flux trapped during wave process from
underneath the standard QFP's.

This question is asked to standardize the fab requirements for all those go
trough standard wave solder process.

re,
ken patel
______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
575 Cottonwood Dr.              Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

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