Please could you advise me on which IPC method would be the most
appropriate for the evaluation of various cleaning processes used after
SMT soldering with water washable fluxes.  I have a copy of the IPC test
methods TM-650 but it is not clear as to which method is specified by
IPC for SMT assemblies.  The methods all appear to be related to raw
carriers and not assembled carriers.

Thanks in advance David Jackson C.Eng

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