No; some of the best, most reliable shops I know have used double-treat
with a great deal of success.

You need to carefully define what type of post-sep you have; first of all,
are you using electroless copper or direct metallization?    If using
electroless copper, is the plated copper separating from the electroless
or is the electroless separating from the innerconnect (pad)?  Are you
seeing full sep, partial or spot sep, or are you seeing what appear to be
cracks on the top and bottom of the innerconnect?  (I believe that you use
D-M, and the D-M that I think you're using DOES NOT make ICDs.  Perhaps
you have a photoresist residue problem, or a desmear problem?)

It would be helpful if you could describe your problem more fully.

Regards, Fred J.
>>> Steves <[log in to unmask]> 12/17/97 05:27am >>>
     Has anyone discovered any problems using reverse treat copper
on innnerlayers in relation to interconnect defects?
(Post separation)

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