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December 1997

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Subject:
board flatness
From:
MARK SIMMONS <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 16 Dec 1997 15:18:39 -0800
Content-Type:
text/plain
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text/plain (21 lines) 
Kudos Matt, and of course there are materials that have improved
dimensional and thermal charachteristics, but they are expensive.

Given all the break throughs in circuit mfg. over recent years, i find
it astounding that the performance of the substrates, remains relatively
unchanged.

Mark

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