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December 1997

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Subject:
From:
"J. Warhelere" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Sun, 14 Dec 1997 21:17:22 -0500
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (55 lines)
People of Technet:

[ Please reply if you have a success or horror story.  One need not
answer all categories, feel free to add some, and this is by no means
a survey ... just a personal inquiry]

In terms of market share, market growth, and profitability;  how would
you rate these technologies?  five years from now, ten years from now,
and so on

1.  hybrid materials
1.1.  microwave
1.2.  high impedance
1.3.  embedded resistivity or diode

2.  flex applications
2.1.  rigid flex
2.2.  hybrid rigid flex
2.3.  flex

3.  high temperature
3.1.  metal core
3.2.  ceramic
3.3.  embedded heat sink

4.  conventional
4.1.  single sided
4.2.  double sided
4.3.  multilayer to 10 layers
4.4.  multilayer over 10 layers

5.  other technologies
5.1.  DCA
5.2.  BGA
5.3.  additive processes
5.4.  laser vias
5.4.  conductive polymers
5.5.

J. Warhelere, Futurist and Speculator

[log in to unmask]

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