Following is posted for a member: Please info copy [log in to unmask] on your reply.  Thanks to all for using the TechNet.  Jack

I am trying to determine the best procedures to use to define the
necessary bake-out procedures, including times and temperatures, for
baking PWBs before and during CCA assembly and prior to conformal
coating.

Our SMT circuit card assembly designs include a .125" metal core with an
8 to 12 layer polyimide PWB bonded to either side, and I'm trying to
preclude the potential for measling prior to soldering and ensure CCAs
are baked adequately prior to conformal coating.

I have reviewed IPC T 50E, pp. 5, 56 and 65, and IPC CM 770, pp. 119 and
125, however I need specific information with which to define and
quantify bake-out procedures.  Any historical reports or
industry-related information on which to base our procedures would of
course be most helpful.



Jack Crawford, IPC Project Manger - Assembly
2215 Sanders Road, Northbrook IL  60062-6135
[log in to unmask]        http://www.ipc.org
847-509-9700 x 393
fax 847-509-9798

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