Typically , the problem we found using LPI on via holes is not removing
the residual LPI from the holes during the developing process .
This problem occurs randomly and I believe it is resulting from the
pressure variabilites in using the hand squeegee process for applying the LPI.
This should be corrected by using automatic screening equipment which would
provide a more consistent and uniform coating .
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Subject: [TN] Liquid Photo Imagible Solder Mask and Vias
Author: "TechNet Mail Forum." <[log in to unmask]>, [log in to unmask] at CCGATE