TECHNET Archives

December 1997

TechNet@IPC.ORG

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Date:
Fri, 12 Dec 1997 12:48:08 PST8
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        Typically , the problem we found using LPI on via holes is not removing
the residual LPI from the holes during the developing process .
         This problem occurs randomly and I believe it is resulting from the
pressure variabilites in using the hand squeegee process for applying the LPI.
This should be corrected by using automatic screening equipment which would
provide a more consistent and uniform coating .
                                                        [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: [TN] Liquid Photo Imagible Solder Mask and Vias
Author:  "TechNet Mail Forum." <[log in to unmask]>, [log in to unmask] at CCGATE


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