Hi Gaby -  I have seen a trend of component manufacturers going away from
Alloy 42 lead material and an increased use of copper lead materials. The
solder joint reliability problems of Alloy 42 leads on surface mount
components under certain conditions that have been documented by Werner
Engelmaier and others investigators has been one reason for the trend.

Dave Hillman
Rockwell Collins
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[log in to unmask] on 12/07/97 05:13:21 PM

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To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  Re: [TN] Reflow Profile - 90/10, Alloy 42




Engelmaier wrote:
>
> Hi Poh,
> For soldering to copper, the minimum reflow temperature should be the
Liquidus
> for the solder used plus 20oC; for soldering to Alloy 42 or nickel it
should
> be Liquidus+30 to 35oC.
>
> Werner Engelmaier
> [log in to unmask]
>
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> ##############################################################I am
confused.I suppose that the question was put not only
theoretically. In practice,I have to deal with a whole circuit board
on which there are many other components which can not support higher
temperatures then the standard reflow profile.How should one cope
with metal case SMT crystals with leads of alloy 42 and 90/10 plating
and solder joint reliability?
I would appreciate very much if you, technetters could give me
some examples from your experience.By the way,what are the future
trends in the component manufacturing industry ,concerning alloy 42
and manufacturability?
Thank you,
Gaby
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