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December 1997

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Subject:
Industry Conditions for Card Assembly Thermal Stress
From:
Charles Carey <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 12 Dec 1997 07:57:12 -0500
Content-Type:
text/plain
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text/plain (31 lines) 
Dear TechNetters,

I work in a packaging reliability group that assesses both module level and
second level
card assembly packages.  A question has arisen in regards to the thermal
cycling conditions
that are typically used for card assemblies.  They are;

1)  What are the typical stress conditions used; maximum temperature, minimum
temperature,
     ramp rates and dwell at each extreme.

2)  Are there tolerance limits that each of the parts in the chamber must meet
for time and temperature.

Any comments will be greatly appreciated.

Chuck Carey

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