TECHNET Archives

December 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jim Gryga <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 11 Dec 1997 13:50:01 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
We have experienced isolated incidents of large pin count, 20 mil QFP's
with vertically non-planer lead forms, resulting in solder fractures after
reflow.  We have determined that our processes are not inducing the
failures and the part vendor claims no responsibility for the planarity
issue.

I'm interested in knowing if any one out there is using a reliable
inspection process at incoming to audit their parts which does not impose
the possibility of damaging the leads in and of itself?  I don't want to
handle the parts any more than necessary, but need some way to ensure that
bad parts don't get to the placement machine.

Jim

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################


ATOM RSS1 RSS2