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December 1997

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Subject:
From:
Rex Beeson <[log in to unmask]>
Reply To:
Rex Beeson <[log in to unmask]>
Date:
Thu, 11 Dec 1997 10:09:27 -0800
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I agree with this statement.

We have used an ammoniacal regineration system for more then 5 years.  The best
gain that came from the system has been stable etch rates.

On feed and bleed systems the copper is pushed to the max. and this is where
the etch rates becomes unstable.  In the regin system copper is held stable
and away form the max.

Regards
Rex Beeson
Raytheon TI Systems


>  From: RSedlak <[log in to unmask]>, on 12/11/97 9:33 AM:
>  FSL (Finishing Services Limited) out of Texas has a system for recycling
>  both
>  ammoniacal and cupric.  I have some limited familiarity with both, as
>  customers of ours have used both, and both require a little bit better
>  housekeeping than using simple feed and bleed replenish.
>
>  The Cupric replenisher seems, (and this may have been user circumstance)
>  particularly prone to picking up resist residues, and clogging.
>
>  The ammoniacal system requires real close attention to amount of air being
>  drawn in, because the cuprous ion tends to build, and this slows etching.
>  Perhaps this really requires putting an anhydrous ammonia pH control on the
>  system, which then allows an excess of air to be put through the system.
>  An
>  excess of air will keep the Cuprous ion down, but also will cause the system
>  to lose too much ammonia, thus depressing pH.
>
>  The fax number for FSL in the US is 972-790-5376
>
>  Rudy Sedlak
>  RD Chemical Company
>
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