Dave,

I would bake PWBs for 2 to 4 hours @ 225F then package them in a heat
sealed barrier bag with desssiccant.  MIL-STD-2073-1C pages 17 & 18
tells how and how much desiccant to use.  I don't know what info is
available in commercial specifications.  Please contact me off-net is
you would like any specific info.

Hope this provides some help,

Dave Girard, CQE, NCE
Product Assurance Engineer
Group Technologies Corporation
(813) 972-6471


> ----------
> From:         Jackson - Dave[SMTP:[log in to unmask]]
> Sent:         Wednesday, December 10, 1997 4:57
> To:   [log in to unmask]
> Subject:      [TN] Storage of Raw pcb to maintain solderability
>
> We are in the process of setting up a far east facility in Malaysia
> which has high levels of ambient temperature and humidity.  I am
> unable
> to find any specifications that define how raw circuits should be
> stored
> to maintain soldrability apart from the vague term of cool and dry.
> Is
> there any information available which states what would be maximum
> storage times at various temperatures and humidities with no special
> pacakaging for cards, with a solder surface finish, that would
> maintain
> acceptable solderability.
>
> Are there any criteria with regard to packaging to extend the storage
> time.  i.e type of dessicant, amount of dessicant, type of ESD bag
> etc.
>
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